2008 Publications

2000 | 2001 | 2002 | 2003 | 2004 | 2005 | 2006 | 2007 | 2008 | 2009

  • Fully Monolithic CMOS Nickel Micromechanical Resonator Oscillator [2008]
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  • 1st Partial-Filled Gap to Strengthen a Capacitive-Gap Transducer [2008]
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  • 1st Micromechanical Resonant Switch (“Resoswitch”) [2008]
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The year 2008 delivered a fully integrated single-chip oscillator that combined in a fully monolithic process a custom CMOS sustaining amplifier with a MEMS-last spring-coupled nickel flexural-mode disk array. While the nickel resonator Q was much lower than polysilicon counterparts and questions on aging remained, this first demonstration is a precursor to work more than a decade later to integrate high frequency metal MEMS in ruthenium for oscillator purposes. This year also brought on the first demonstration of partial gap-filling to improve capacitive-gap transducer strength, as well as the first demonstration of a micromechanical resoswitch–a device destined for use in the first all-mechanical communication receiver almost a decade later.

W.-L. Huang, Z. Ren, Y.-W. Lin, H.-Y. Chen, J. Lahann, and C. T.-C. Nguyen, “Fully monolithic CMOS nickel micromechanical resonator oscillator,” Tech. Digest, 21st IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’08), Tucson, Arizona, Jan. 13-17, 2008, pp. 10-13.

Y. Xie, S.-S. Li, Y.-W. Lin, Z. Ren, and C. T.-C. Nguyen, “1.52-GHz micromechanical extensional wine-glass mode ring resonators,” IEEE Trans. Ultrason., Ferroelect., Freq. Contr., vol. 55, no. 4, pp. 890-907, April 2008. (18 pages)

C. T.-C. Nguyen, “Integrated micromechanical radio front-ends (invited plenary),” Proceedings of Tech. Program, 2008 IEEE Int. Symp. On VLSI Technology, Systems, and Applications (VLSI-TSA’08), Hsinchu, Taiwan, April 21-23, 2008, pp. 3-4.

Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “A resonance dynamical approach to faster, more reliable micromechanical switches,” Proceedings, 2008 IEEE Int. Frequency Control Symp., Honolulu, Hawaii, May 19-21, 2008, pp. 640-645.

L.-W. Hung, Z. A. Jacobson, Z. Ren, A. Javey, and C. T.-C. Nguyen, “Capacitive transducer strengthening via ALD-enabled partial-gap filling,” Tech. Digest, 2008 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 1-5, 2008, pp. 208-211.

Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “The micromechanical resonant switch (“resoswitch”),” Tech. Digest, 2008 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 1-5, 2008, pp. 40-43.