2001 Publications

2000 | 2001 | 2002 | 2003 | 2004 | 2005 | 2006 | 2007 | 2008 | 2009

  • First Analytical Treatment for Intermodulation Distortion in Capacitive-Gap Transduced Micromechanical Resonators [2001]
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  • Lateral Free-Free Beam With Metal Electrodes and Sub-Micron Lateral Electrode-to-Resonator Gaps [2001]
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  • Bonded-Microplatform MEMS-Transistor Merging [2001]
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The year 2001 brought on rapid advancements in lateral resonator technology, including methods for using metal electrodes (for smaller interconnect resistance) with submicron electrode-to-resonator gaps, lateral free-free-beams for higher Q, and methods for realizing sensors based on such resonators. Packaging and integration technologies also entered the picture for the first time, including a vacuum packaging method employing the localized annealing concept from earlier years and a bonded microplatform approach that compression-bonded MEMS upside down to transistor electronics while also providing vacuum packaging. Finally, the year saw demonstrated of the first 10-MHz Pierce oscillator using a polysilicon MEMS resonator, as well as the first analytical understanding of third-order intermodulation distortion nonlinearity in capacitive-gap transduced micromechanical resonators.

Y.-T. Cheng, W.-T. Hsu, L. Lin, C. T.-C. Nguyen, and K. Najafi, “Vacuum packaging using localized aluminum/silicon-to-glass bonding,” Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 18-21.

W.-T. Hsu, J. R. Clark, and C. T.-C. Nguyen, “A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators,” Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 349-352.

R. Navid, J. R. Clark, M. Demirci, and C. T.-C. Nguyen, “Third-order intermodulation distortion in capacitively-driven CC-beam micromechanical resonators,” Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 228-231.

J. R. Clark, W.-T. Hsu, and C. T.-C. Nguyen, “Measurement techniques for capacitively-transduced VHF-to-UHF micromechanical resonators,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany
, June 10-14, 2001, pp. 1118-1121.

A.-C. Wong, Y. Xie, and C. T.-C. Nguyen, “A bonded-micro-platform technology for modular merging of RF MEMS and transistor circuits,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001, pp. 992-995.

W. -T. Hsu, J. R. Clark, and C. T. -C. Nguyen, “A resonant temperature sensor based on electrical spring softening,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transduc­ers’01), Munich, Germany, June 10-14, 2001, pp. 1484-1487.

W. -T. Hsu, J. R. Clark, and C. T. -C. Nguyen, “Q-optimized lateral free-free beam micromechanical resonators,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001, pp. 1110-1113.

S. Lee, M. U. Demirci, and Clark T.-C. Nguyen, “A 10-MHz micromechanical resonator Pierce reference oscillator for communications,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001, pp. 1094-1097.

C. T.-C. Nguyen, “Vibrating RF MEMS for low power wireless communications (invited keynote),” Proceedings, 2000 Int. MEMS Work shop (iMEMS’01), Singapore, July 4-6, 2001, pp. 21-34.

C. T.-C. Nguyen, “Transceiver front-end architectures using vibrating micromechanical signal processors (invited),” Dig. of Papers, Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Sept. 12-14, 2001, pp. 23-32.

C. T.-C. Nguyen, “RF MEMS for Low-Power Communications,” Extended Abstracts, 2001 Int. Conf. on Solid-State Devices and Materials (SSDM’01), Tokyo, Japan, Sept. 26-28, 2001, pp. 462-463.

C. T.-C. Nguyen, “Transceiver front-end architectures using vibrating micromechanical signal processors,” chapter in RF Technologies for Low Power Wireless Communications, edited by G. I. Haddad, T. Itoh, and J. Harvey, pp. 411-461. New York: Wiley IEEE-Press, 2001. (50 pages)