2002 Publications

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  • CVD Polydiamond Folded-Beam Comb-Driven Resonator [2002]
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  • Electrical-Stiffness Compensated Resonator With Only 18 ppm Frequency Shift From 25-125oC [2002]
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The year 2002 brought about the first CVD polydiamond MEMS devices, identifying this material as more stable and higher frequency than other popular materials at the time; and the first MEMS resonator to post temperature stability (without the aid of transistor control) commensurate with the needs to practical timing applications and substantially better than achievable by quartz counterparts. The first company formed to commercialize MEMS-based timing, Discera, founded by me, had been going for about a year at this point. It was not long before several other start-ups joined the game, encouraged by Discera’s success and results like this.

J. Wang, J. E. Butler, D. S. Y. Hsu, and C. T.-C. Nguyen, “CVD polycrystalline diamond high-Q micromechanical resonators” Tech. Digest, 2002 IEEE Int. Micro Electro Mechanical Systems Conf., Las Vegas, Jan. 20-24, 2002, pp. 657-660.

W. -T. Hsu and C. T. -C. Nguyen, “Stiffness-compensated temperature-insensitive micromechanical resonators,” Tech. Digest, 2002 IEEE Int. Micro Electro Mechanical Systems Conf., Las Vegas, Nevada, Jan. 20-24, 2002, pp. 731-734.

Y. Xie and C. T.-C. Nguyen, “A low-voltage tiltable microplatform using bent-beam actuation” Tech. Digest, 2002 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 2-6, 2002, pp. 350-353.

J. Wang, J. E. Butler, D. S. Y. Hsu, and C. T.-C. Nguyen, “High-Q micromechanical resonators in CH4-reactant-optimized high acoustic velocity CVD polydiamond,” Tech. Digest, 2002 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 2-6, 2002, pp. 61-62.

C. T.-C. Nguyen, “RF MEMS for wireless applications (invited keynote),” Conf. Digest, 2002 Device Research Conference, Santa Barbara, California, June 24-26, 2002, pp. 9-12.

Y.-T. Cheng, W.-T. Hsu, K. Najafi, C. T.-C. Nguyen, and L. Lin, “Vacuum packaging technology using localized aluminum/silicon-to-glass bonding,” IEEE/ASME J. Microelectromech. Syst., vol. 11, no. 5, pp. 556-565, Oct. 2002. (10 pages)

C. T.-C. Nguyen, “Vibrating RF MEMS for low power communications (invited),” Proceedings, 2002 MRS Fall Meeting, Boston, Massachusetts, Dec. 2-6, 2002, pp. J12.1.1-J12.1.12.