Why Use an MCM Today?
Why Use an MCM Today?
m Performance Improvement:
4-6 ns improvement in typical CMOS applicationsLow I/O inductanceLow interconnect capacitanceExcellent power and ground distributionShorter interconnect distances
m Footprint Reduction:
5 to 10 times reduction in footprintVery high interconnect densityModule pad pitch equal die pad pitch (4 mil)Currently 72 mil chip-to-chip spacing
m Cost Reduction:
Cost effective today; cost reduction in futureIC yield improvement for a given system speedEliminates multiple high-pin count packagesReduces size, layer count of printed circuit board Reduces manufacturing steps