Why Multi-Chip Subsystems?
Why Multi-Chip Subsystems?
m Silicon fab. costs rising sharply (> $1B for 0.35m )
Ô Difficult to make a profit on chips (e.g. 64Mbit DRAM)
m To maximize chip profit can't afford to change masks very often!
Ô Preference for high-volume "standard parts"
m Same parts will be used in many different "standard chipsets"
Ô Additional margin in specific interconnections of die and associated development systems.
m Leads to "standard MCMs" as strategic business for successful chip companies to leverage silicon.