The Future of First-Level Packaging: Déja Vu?
The Future of First-Level Packaging: Déja Vu?
m Boards are becoming increasingly sophisticated (e.g. <4mil lines & spaces, MCMs, COB)
Ô Off-shore quotes up to 10x lower priceÔ 20% reduction in number of independent US PCB suppliers from 1989-90.
m With very high cost of semiconductor fabrication, first-level package provides strategic product value-added to high-volume standard components