NAME
|
PhD
THESIS
|
graduated
|
EMPLOYER
|
Sriram Balasubramanian
|
Nanoscale Thin-Body MOSFETs: Technology
and Applications
|
2006
|
GLOBALFOUNDRIES Inc.
(Sunnyvale, CA)
|
Andrew Carlson
|
Device
and Circuit Techniques for Reducing Variation in Nanoscale
SRAM
|
2008
|
Tilera Corporation (Boston,
MA) |
I-Ru "Tim" Chen
|
Novel Material Integration for Reliable and Energy-Efficient NEM Relay Technology
|
2014
|
Xilinx, Inc. (San Jose, CA) |
Yenhao "Philip" Chen
|
Reliability Studies of Micro-Relays for Digital Logic Applications
|
2015
|
Knowles Electronics , LLC (Itasca, IL) |
Min Hee Cho
|
Thin-Body SOI Capacitorless DRAM Cell Design Optimization and Scaling
|
2012
|
Samsung Electronics Co., Ltd.(Seoul, Republic of Korea) |
Nattapol Damrongplasit
|
Study of Variability in Advanced Transistor Technologies
|
2012
|
Intel Corporation (Hillsboro, OR) |
Fei Ding
|
Design for Performance and Reliability in Advanced CMOS Structures
|
2020
|
Google (Palo Alto,
CA)
|
Tsegereda Esatu
|
Novel Non-Volatile Memory Devices and Applications
|
2023
|
Marie-Ange Eyoum
|
Modularly Integrated MEMS
Technology
|
2006
|
Yahoo Inc. (Sunnyvale,
CA)
|
| Andrea E. Franke |
Polycrystalline Silicon-Germanium
Films for Integrated Microsystems
|
2000
|
(deceased)
|
Daniel Good
|
Novel
Processes for Poly-Si Thin-Film Transistors on Plastic
Substrates
|
2007
|
(independent consultant)
|
Byron Ho
|
Evolutionary MOSFET Structure and Channel Design for Nanoscale CMOS Technology
|
2012
|
Apple Inc. (San Diego,
CA)
|
Xiaoer Hu
|
Micro-Electro-Mechanical Relay Technology for Beyond-Von-Neumannn Computer Architectures
|
2022
|
Applied Materials (Santa Clara,
CA)
|
Xuejue Huang
|
Modeling and Design Optimization of
Multi-GHz IC Interconnects
|
2002
|
Intel Corporation (Phoenix,
AZ)
|
| Zachery Jacobson |
Band-to-Band Tunneling Transistors: Scalability and Circuit Performance |
2012 |
McKinsey & Company (New York, NY) |
| Jaeseok Jeon |
Advanced Relay Design and Technology
for Energy-Efficient Electronics |
2011 |
Maritime College, The State
University of New York (Throggs Neck, NY) |
Qing Ji
|
Maskless, Resistless Ion Beam
Lithography Processes
|
2003
|
Lawrence Berkeley National Laboratory
(Berkeley, CA)
|
Pankaj Kalra
|
Advanced
Source/Drain Technologies for Nanoscale CMOS
|
2008
|
Western Digital Corporation (Milpitas,
CA)
|
| Hei Kam |
MOSFET Replacement Devices for
Energy-Efficient Digital Integrated Circuits |
2010 |
Apple Inc.
(Cupertino, CA) |
| Sung Hwan Kim |
Germanium-Source Tunnel Field Effect Transistors for Ultra-Low Power Digital Logic |
2012 |
Apple Inc.
(Cupertino, CA) |
| Wook Hyun Kwon |
Novel Technologies for Next Generation Memory |
2013 |
Samsung Electronics Co., Ltd.
(Seoul, Republic of Korea) |
Joanna Lai
|
Novel
Processes and Structures for Low Temperature Fabrication of
Integrated Circuit Devices
|
2008
|
Apple Inc. (Cupertino,
CA) |
| Donovan Lee |
Nanoelectromechanical Systems (NEMS)
Devices and Technology |
2009 |
Apple Inc.
(Cupertino, CA) |
| Peter Matheu |
Investigations of Tunneling for Field Effect Transistors |
2012 |
Google
(Mountain View, CA)
|
| Rhesa Nathanael |
Nano-Electro-Mechanical (NEM) Relay Devices and Technology for Ultra-Low Energy Digital Integrated Circuits |
2012 |
Xilinx (San Jose, CA) |
| Benjamin Osoba |
Milli-Volt Micro-Electro-Mechanical Relay Technology for Energy-Efficient Computing |
2021 |
Nikon Research Corporation of America (Belmont, CA) |
Alvaro Padilla
|
Advanced Transistor Structures and Charge
Detection Methods for Flash Memory
|
2007
|
Western Digital Corporation (Milpitas,
CA)
|
Eung Seok Park
|
Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems
|
2013
|
Samsung Electronics Co., Ltd. (Republic of Korea) |
Chuang Qian
|
Electromechanical Devices for Ultra-Low-Power Electronics |
2016
|
Apple Inc.
(Cupertino, CA) |
Pushkar Ranade
|
Advanced Gate Materials and Processes for
Sub-70nm CMOS Technology
|
2002
|
Intel Corporation
(Santa Clara, CA)
|
Thomas Rembert
|
Low Thermal Budget Process Engineering for Flexible Electronics, Sensors, and Nanoscale Patterning
|
2020
|
Min She
|
Semiconductor Flash Memory Scaling
|
2003
|
Marvell Semiconductor, Inc.
(Santa Clara, CA)
|
| Changhwan Shin |
Advanced MOSFET Designs and
Implications for SRAM Scaling |
2011 |
University of Seoul (Seoul, Republic of Korea) |
Kyoungsub Shin
|
Technologies for Enhancing Multi-Gate Si
MOSFET Performance
|
2007
|
Samsung Electronics Co., Ltd. (Republic of Korea) |
Urmita Sikder
|
Nanoelectromechanical Switch Design and Implementation in Back-End-of-Line Technology
|
2021
|
EECS Department, UC Berkeley (Berkeley, CA)
|
| Xin Sun |
Nanoscale Bulk MOSFET Design and
Process Technology for Reduced Variability |
2010 |
FountainCap Research & Investment
(Hong Kong)
|
Yeh-Jiun Tung
|
Polycrystalline Silicon Thin-Film Transistor
Technology for Flexible Large-Area Electronics
|
2001
|
Google
(Mountain View, CA)
|
| Reinaldo Vega |
Advanced Source/Drain and Contact
Design for Nanoscale CMOS |
2010 |
IBM Corporation (East
Fishkill, NY) |
Varadarajan Vidya
|
Thin-Body
FET Devices and Technology
|
2007
|
IBM Corporation (East
Fishkill, NY)
|
Hiu Yung Wong
|
Advanced
gate processes for nanoscale CMOS |
2006
|
San Jose State University (San Jose, CA)
|
Nuo Xu
|
Effectiveness of Strain Solutions for Next-Generation MOSFETs |
2012
|
TSMC North America
(San Jose, CA)
|
Jack Yaung
|
NEM Relay Scaling for Ultra-low Power Digital Logic |
2014
|
Intel Corporation
(Hillsboro, OR) |
Zhixin Alice Ye
|
NEM Relay Scaling for Millivolt Micro-Electro-Mechanical Relay Devices & Circuits |
2020
|
NVIDIA Corporation
(Santa Clara, CA) |
Xi Zhang
|
Oxygen-insertion Technology for CMOS Performance Enhancement
|
2019
|
Intel Corporation (Folsom, CA) |
Peng Zheng
|
Advanced MOSFET Structures and Processes for Sub-7 nm CMOS Technologies
|
2016
|
Apple Inc. (Cupertino,
CA) |