CURRENT Ph.D. STUDENTS

NAME RESEARCH AREA graduating
FUNDING SOURCE
Tsegereda Esatu Emerging non-volatile-memory devices and applications 2023 University of California Office of the President
Xiaoer Hu New applications for micro-electro-mechanical relay technology 2022 EECS Department
Lars Tatum Beyond Moore's Law computing technologies ~2024 National Science Foundation Graduate Fellowship Program

    FORMER Ph.D. STUDENTS

    >
    NAME
    PhD THESIS
    graduated
    EMPLOYER
    Sriram Balasubramanian
    Nanoscale Thin-Body MOSFETs: Technology and Applications
    2006
    GLOBALFOUNDRIES Inc. (Sunnyvale, CA)
    Andrew Carlson
    Device and Circuit Techniques for Reducing Variation in Nanoscale SRAM
    2008
    Tilera Corporation (Boston, MA)
    I-Ru "Tim" Chen
    Novel Material Integration for Reliable and Energy-Efficient NEM Relay Technology
    2014
    Xilinx, Inc. (San Jose, CA)
    Yenhao "Philip" Chen
    Reliability Studies of Micro-Relays for Digital Logic Applications
    2015
    Knowles Electronics , LLC (Itasca, IL)
    Min Hee Cho
    Thin-Body SOI Capacitorless DRAM Cell Design Optimization and Scaling
    2012

    Samsung Electronics, Inc.(Seoul, Republic of Korea)

    Nattapol Damrongplasit
    Study of Variability in Advanced Transistor Technologies
    2012

    Intel Corporation (Hillsboro, OR)

    Fei Ding
    Design for Performance and Reliability in Advanced CMOS Structures
    2020
    Google (Palo Alto, CA)
    Marie-Ange Eyoum
    Modularly Integrated MEMS Technology
    2006
    Intel Corporation (Santa Clara, CA)
    Andrea E. Franke Polycrystalline Silicon-Germanium Films for Integrated Microsystems
    2000
    (deceased)
    Daniel Good
    Novel Processes for Poly-Si Thin-Film Transistors on Plastic Substrates
    2007
    (independent consultant)
    Byron Ho
    Evolutionary MOSFET Structure and Channel Design for Nanoscale CMOS Technology
    2012
    Intel Corporation (Hillsboro, OR)
    Xuejue Huang
    Modeling and Design Optimization of Multi-GHz IC Interconnects
    2002
    Intel Corporation (Phoenix, AZ)
    Zachery Jacobson Band-to-Band Tunneling Transistors: Scalability and Circuit Performance 2012 McKinsey & Company (New York, NY)
    Jaeseok Jeon Advanced Relay Design and Technology for Energy-Efficient Electronics 2011 Maritime College, The State University of New York (Throggs Neck, NY)
    Qing Ji
    Maskless, Resistless Ion Beam Lithography Processes
    2003
    Lawrence Berkeley National Laboratory (Berkeley, CA)
    Pankaj Kalra
    Advanced Source/Drain Technologies for Nanoscale CMOS
    2008
    Western Digital Corporation (Milpitas, CA)
    Hei Kam MOSFET Replacement Devices for Energy-Efficient Digital Integrated Circuits 2010 Apple Inc. (Cupertino, CA)
    Sung Hwan Kim Germanium-Source Tunnel Field Effect Transistors for Ultra-Low Power Digital Logic 2012 Apple Inc. (Cupertino, CA)
    Wook Hyun Kwon Novel Technologies for Next Generation Memory 2013 Samsung Electronics, Inc. (Seoul, Republic of Korea)
    Joanna Lai
    Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices
    2008
    Western Digital Corporation (Milpitas, CA)
    Donovan Lee Nanoelectromechanical Systems (NEMS) Devices and Technology 2009 Apple Inc. (Cupertino, CA)
    Peter Matheu Investigations of Tunneling for Field Effect Transistors 2012 Xockets Inc.
    Rhesa Nathanael Nano-Electro-Mechanical (NEM) Relay Devices and Technology for Ultra-Low Energy Digital Integrated Circuits 2012 Xilinx (San Jose, CA)
    Benjamin Osoba Milli-Volt Micro-Electro-Mechanical Relay Technology for Energy-Efficient Computing 2021 Nikon Research Corporation of America (Belmont, CA)
    Alvaro Padilla
    Advanced Transistor Structures and Charge Detection Methods for Flash Memory
    2007
    Western Digital Corporation (Milpitas, CA)
    Eung Seok Park
    Application of Inkjet-Printing Technology to Micro-Electro-Mechanical Systems
    2013
    Samsung Electronics, Inc. (Republic of Korea)
    Chuang Qian
    Electromechanical Devices for Ultra-Low-Power Electronics 2016
    Apple Inc. (Cupertino, CA)
    Pushkar Ranade
    Advanced Gate Materials and Processes for Sub-70nm CMOS Technology
    2002
    Intel Corporation (Santa Clara, CA)
    Thomas Rembert
    Low Thermal Budget Process Engineering for Flexible Electronics, Sensors, and Nanoscale Patterning
    2020
    EECS Department, UC Berkeley (Berkeley, CA)
    Min She
    Semiconductor Flash Memory Scaling
    2003
    Marvell Semiconductor, Inc. (Santa Clara, CA)
    Changhwan Shin Advanced MOSFET Designs and Implications for SRAM Scaling 2011 University of Seoul (Seoul, Republic of Korea)
    Kyoungsub Shin
    Technologies for Enhancing Multi-Gate Si MOSFET Performance
    2007
    Samsung Electronics, Inc. (Republic of Korea)
    Urmita Sikder
    Nanoelectromechanical Switch Design and Implementation in Back-End-of-Line Technology
    2021
    EECS Department, UC Berkeley (Berkeley, CA)
    Xin Sun Nanoscale Bulk MOSFET Design and Process Technology for Reduced Variability 2010 Sanford C. Bernstein & Co., LLC (Santa Clara, CA)
    Yeh-Jiun Tung
    Polycrystalline Silicon Thin-Film Transistor Technology for Flexible Large-Area Electronics
    2001
    Google (Mountain View, CA)
    Reinaldo Vega Advanced Source/Drain and Contact Design for Nanoscale CMOS 2010 IBM Corporation (East Fishkill, NY)
    Varadarajan Vidya
    Thin-Body FET Devices and Technology
    2007
    IBM Corporation (East Fishkill, NY)
    Hiu Yung Wong
    Advanced gate processes for nanoscale CMOS 2006
    Synopsys, Inc. (Mountain View, CA)
    Nuo Xu
    Effectiveness of Strain Solutions for Next-Generation MOSFETs 2012
    TSMC North America (San Jose, CA)
    Jack Yaung
    NEM Relay Scaling for Ultra-low Power Digital Logic 2014
    Intel Corporation (Hillsboro, OR)
    Zhixin Alice Ye
    NEM Relay Scaling for Millivolt Micro-Electro-Mechanical Relay Devices & Circuits 2020
    NVIDIA Corporation (Santa Clara, CA)
    Xi Zhang
    Oxygen-insertion Technology for CMOS Performance Enhancement
    2019
    Intel Corporation (Folsom, CA)
    Peng Zheng
    Advanced MOSFET Structures and Processes for Sub-7 nm CMOS Technologies
    2016
    Intel Corporation (Hillsboro, OR)

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    FORMER STUDENTS SERVED AS Ph.D. RESEARCH CO-ADVISOR


    NAME
    PhD THESIS
    graduated
    EMPLOYER
    Leland Chang
    Nanoscale Thin-Body CMOS Devices
    2003
    IBM Corporation (Yorktown Heights, NY)
    Yang-Kyu Choi
    Nanofabrication Technologies and Novel Device Structures for Nanoscale CMOS
    2001
    KAIST (Republic of Korea)
    Daewon Ha
    Advanced materials and structures for nanoscale CMOS 2004
    Samsung Electronics, Inc. (Republic of Korea)
    John M. Heck
    Polycrystalline Silicon Germanium for Fabrication, Release, and Packaging of Microelectromechanical Systems
    2001
    Intel Corporation (Santa Clara, CA)
    Ya-Chin King
    Thin Dielectric Technology and Memory Devices
    1999
    National Tsing Hua University (Hsinchu, Taiwan R.O.C.)
    Charles Kuo
    Scaling CMOS Memories
    2002
    Intel Corporation (Hillsboro, OR)
    Wen-Chin Lee
    Poly-Si1-xGex Gate Technology and Direct-Tunneling Oxide for Deep-Submicron CMOS Application
    1999
    Taiwan Semiconductor Manufacturing Company (Hsinchu, Taiwan R.O.C.)
    Blake C. Lin
    Integrated MEMS Technologies for Adaptive Optics
    2008
    Intel Corporation (Hillsboro, OR)
    Nick Lindert
    Process Development and Device Design for Continued MOSFET Scaling
    2001
    Intel Corporation (Hillsboro, OR)
    Gang Liu
    CMOS Power Amplifiers
    2006
    Spintrol Technology (Shanghai, China)
    Carrie W. Low
    Novel Processes for Modular Integration of SiGe MEMS with CMOS Electronics
    2006
    InSense Inc. (Fremont, CA)
    Qiang Lu
    Advanced Gate Stack Materials and Processes for Sub-100nm CMOS Applications
    2002
    Synopsys, Inc. (Mountain View, CA)
    Igor Polishchuk
    Gate Stack for Sub-50nm CMOS Devices: Materials, Engineering and Modeling
    2002
    Cypress Semiconductor (San Jose, CA)
    Kevin Yang
    Characterization and Modeling of Advanced Gate Dielectrics
    2002
    GLOBALFOUNDRIES Inc. (Sunnyvale, CA)
    Yee-Chia Yeo
    Gate-Stack and Channel Engineering for Advanced CMOS Technology
    2002
    Taiwan Semiconductor Manufacturing Company (Hsinchu, Taiwan R.O.C.)

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    Last updated October 2021