CAD Issues for Multi-Chip Modules
CAD Issues for Multi-Chip Modules
m Technology Modelling & Simulation
Ô Accurate models for predicting pin-out, performance, routing, yield, MTBF, cost, etc. of various MCM technologies.Ô Models for lossy (>50MHz) and frequency-dependent lossy (>200MHz) transmission lines for I/O design.Ô Simulation and accurate prediction of noise, power dissipation, thermal and mechanical factors