2019 Publications

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The year 2019 introduced a super-regenerative receiver front-end using a parametric MEMS-based oscillator and an electrical stiffness-based resonant ring strain sensor with a remarkable insensitivity to environmental influences. It also demonstrated the strongest on-chip electromechanical coupling strength to date on the order of 70% (intrinsic) via a square plate flexural-mode resonator with 14-nm capacitive-gap transducers. The strong transducers permitted unprecedented frequency tuning of more than 46% for a high Q mechanical resonator. Finally, this year produced the two part epic paper describing design and demonstration of a micromechanical disk-array RF channel-select filter that established and disseminated many of the key methods and principles behind hierarchical micromechanical signal processor circuit design, including buffering to alleviate stress in medium- and large-scale-integrated mechanical circuits.

A. Ozgurluk, M. Akgul, and C. T.-C. Nguyen, “RF channel-select micromechanical disk filters—part I: design,” IEEE Trans. Ultrason., Ferroelect., Freq. Contr., vo. 66, no. 1, pp.192-217, Jan. 2019 (26 pages).

M. Akgul, A. Ozgurluk, and C. T.-C. Nguyen, “RF channel-select micromechanical disk filters—part II: demonstration,” IEEE Trans. Ultrason., Ferroelect., Freq. Contr., vo. 66, no. 1, pp.218-235, Jan. 2019 (18 pages).

A. Ozgurluk, K. A. Peleaux, and C. T.-C. Nguyen, “Widely tunable 20-nm-gap ruthenium metal square-plate resonator,” Tech. Digest, 2019 IEEE Int. Micro Electromechanical Systems Conference, Seoul, Korea, Jan. 27-31, 2019, pp. 153-156, DOI: 10.1109/MEMSYS.2019.8870623.

K. A. Peleaux, T.-P. K. Nguyen, A. Anton, and C. T.-C. Nguyen, “A parametric MEMS oscillator-based super-regenerative receiver front-end,” Proceedings, IEEE Int. Frequency Control Symp., Orlando, Florida, April 14-18, 2019, DOI: 10.1109/FCS.2019.8856028.

A. Ozgurluk and C. T.-C. Nguyen, “On-chip precision residual strain diagnostic based on gap-dependent electrical stiffness,” Proceedings of the 20th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (Transducers’19), Berlin Germany, June 23-27, 2019, pp. 2029-2032, DOI: 10.1109/TRANSDUCERS.2019.8808299.