Advantages of SiO2
Advantages of SiO2
m Chemical inertness
m Attractive mechanical properties
- Outstanding thermal stability
- High strength (1 GPa) & stiffness
- Compressive stress preload
- Low expansion coefficient
m Consistent, controlled deposition
- Minimum # of process parameters
- No corrosion of Cu (e.g., from polyamic acid)
- 360° Ni cladding not required
Ô Lower-cost process
- Easily reworked die attach
- High-yield (.99995) wire bonding
- TAB & flip-chip compatibility
- Flat, stress-balanced substrates
Ô Improved manufacturability
- Excellent thickness control
- ±2% within wafer
- ±2% wafer-to-wafer
- Properties not subject to lot-to-lot variations
FEATURE
BENEFIT