CAD Issues for Multi-Chip Modules
CAD Issues for Multi-Chip Modules
m Technology Modelling
Ô Accurate models for predicting pin-out, performance, routing, yield, MTBF, cost, etc. of various MCM technologies.
m Efficient tools for design partitioning, considering complex constraints.
Ô Pin limitations, power requirements, performance, cost, MTBF, etc.
m Tools for thermal and mechanical analysis of MCMs and associated ICs.
m Tools for high-performance device analysis (e.g. inductance & transmission lines), noise prediction, simulation.
m Tools for placement & routing of n-layer (4+) MCMs, including power and ground.
Ô O(600+) pins/chip, considering signal reflections, coupling, etc.