Multi-Chip Modules
Multi-Chip Modules
m Should not be compared to present PCB/PWB industry!
Ô Tighter coupling to chip technologyÔ Increasing sophistication for VLSI (e.g. Fujitsu 42 layers, ETA 44 layers, NEC LCM 5 layer, 75 micron pitch)l
m PCB/packaging industry not keeping up with the IC industry
Ô Feature size, performance, pin-out Ô Larger chips (e.g. WSI) almost never better in performance
m Next Generation: Need new, low-cost, high-performance, high-density packaging technologies and associated design tools.