Microlaze
Microlaze is a system for automated laser micromachining, developed in
Prof.
Ron Fearing's group. It reads a G-code file (created from a DXF file)
to cut traces or score lines down to 2 microns wide with sub-micron accuracy.
A flexible command-line interface is provided.
This page is a quick reference for frequent Microlaze users. For details
and source code, please see the Microlaze User
Manual.
Quick Start
-
Produce DXF cut file and/or separate score file. (E.g. export a SolidWorks
drawing
to DXF. You can hide cut and/or score lines.)
-
Turn on all the equipment (stage, monitor, light source, laser enable).
-
On LASERMACHINE station, Run GCode program on Start menu to convert from
DXF to G-code.
-
Possibly run microlazeconfig configfile from the command prompt
to create/modify a config file to specify laser power, cutting parameters,
etc.
-
Position part under laser and manually focus.
-
Run microlaze [-c configfile] [-s scorefile] [cutfile] from the
command prompt. If you specify a score file and a cut file, the score file
runs first.
-
If you had to stop the job and need to resume, you can run microlaze with
the -l startline option to start at the specified line in the
G-code file.
-
NOTE: The programs are in E:\bin which should already be on the path.
Quick Start for offset files
-
Before you run microlaze to cut/score the part, run microlazeaxis
which marks an origin and X axis.
-
After you cut/score your part, you may take it out.
-
When you replace your part, run microlazeoffset offsetfile and
follow instructions to find the origin and X axis.
-
Run microlaze again using the -o offsetfile option.
-
Or you can also use the [-ox xOffset] [-oy yOffset] [-oa angleOffset]
options to manually set the offsets
Quick Start for stage utilities
-
stagexy [x y]: With no arguments, this displays the current position.
With [x y], this moves the stage to x,y in millimeters.
-
resetstage : This makes the current stage position (0, 0) for
all future motions.
-
homestage : This moves the stage to (0, 0). The difference from
"stagexy 0 0" is that homestage also opens the laser
marker to fully open.
Tips and Tricks
-
To hold sheet metal down, put a little water on a glass slide and press
the sheet metal on it.
-
Or, to hold sheet metal down, use Gel-Pak #WF-80-X4 with double-sided tape.
-
Make sure nothing can slide due to rapid stage movements. Use scotch tape
if necessary.
-
To remove metal dust after cutting, use ultrasonic cleaner or weak acid
such as 10% hydrochloric acid.
-
Reboot the control PC weekly to reset the serial ports. Otherwise Windows
NT gets confused after running too long.
-
The Z direction (focus) motor moves the stage by pressing a rubber pad
against the Z knob. You must occasionally retighten it when focussing malfunctions.
-
The camera is loose and can misalign (doesn't affect laser alignment) -
use shim to stabilize.
-
Debris from cutting gets on lens. Occasionally, clean with D.I. water and
lens paper.
Config Settings
These settings are the same for all materials:
-
Wavelength: Green
-
Energy Range: HI
-
Pulserate: 40 Hz
-
Marker Size: 100x100
-
Min Focus Score: 800
These depend on the magnification:
Magnification |
Marker Size (mm) at 100x100 |
Cut Step Size (mm) |
Score Step Size (mm) |
Focus Offcenter Distance (mm) |
50x |
0.050 |
0.025 |
0.15 |
0.1 |
100x |
0.025 (NOTE: higher power density than 50x) |
0.020 |
0.075 |
0.05 |
These depend on the material:
Material |
Laser Power |
Cut Hold Time (sec) |
Cut Feed Speed |
Score Hold Time (sec) |
Distance to Refocus (mm) |
Stainless Steel (12 micron) |
1000 |
1 |
100 |
1 |
0.5 |
Polyester (6 layers) |
1000 |
1 |
1 |
1 |
0 |
Enamel paint/polyimide mask |
300 |
1 |
1 |
1 |
0.5 |
Copper film (25 micron) |
1000 |
3.5 |
100 |
2 |
0.5 |
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