TuTh
12:30-2
Class
info, homework questions, discussion, etc: piazza
Grades:
bcourses
All homework
All Old Exams
Archives from previous
semesters. Note that there are many
homework solutions posted here! These
are fair game, as long as you cite the source if you copy them directly. If you *don’t* cite the source when you copy
directly, that’s cheating. See below.
My policy on CHEATING. READ IT!
|
Instructor Office Hours |
Kristofer
S.J. Pister, pister@eecs.berkeley.edu 512
Cory Hall M
3-4, Th 2-3 or by email appointment. |
||||||||||||||||||
|
TA Office
Hours |
Dillon
Acker-James, dackerjames@berkeley.edu M
10-11, W 12-1 location TBA |
||||||||||||||||||
|
Required
Texts |
none |
||||||||||||||||||
|
Useful
Texts |
Jaeger,
Introduction
to Microelectronic Fabrication, 2nd edition, (highly
recommended) ----------------------------------------------------- Kaajakari, Practical MEMS Kubby, A
Guide to Hands-on MEMS Design and Prototyping Korvink & Paul, MEMS: A
Practical Guide to Design, Analysis, and Applications Kovacs,
Micromachined Transducers Sourcebook Liu,
Foundations of MEMS, 2nd edition Senturia, Microsystem Design Madou, Fundamentals of Microfabrication Young,
Roark’s Formulas for Stress and Strain |
||||||||||||||||||
|
Grading |
|
||||||||||||||||||
|
homework |
Collaboration
is encouraged; copying is not. Explaining how you solved a problem to
someone is fine; handing them your solutions is not. Helping someone debug their design is fine;
giving them your design is not. Write
your own answers without staring at someone else's. (see cheating policy
above) |
||||||||||||||||||
|
Lectures |
My
nearly indecipherable notes are generally online a day or two after class
(linked below). |
Schedule
|
Week |
Date/ Notes |
Topic |
Reading
/ Resources |
homework |
|
1 |
8/26 |
Logistics;
What is MEMS; Applications; Course overview, history
Single-mask
SOI process |
Jaeger: skim chapter 1, and 2.1—2.4. Make sure that you understand Figures 2.{2,
6, 7, 9+11} |
|
|
2 |
8/31 9/2 |
Single-mask
capacitive accelerometer simple differential capacitive accelerometer Electrostatic Actuators; Surface micromachining;
three-mask process; |
Jaeger: 11.1, 11.4 |
|
|
3 |
9/7 9/9 |
Surface micromachining: 1 and 2 poly processes Standard Processes: SOIMUMPs,
POLYMUMPs,
polyMUMPS pictures,
SOIMUMPS pictures;
stress and strain |
|
|
|
4 |
9/14 9/16 |
beam bending, flexure design, torsion, residual stress, stress gradients, buckling |
Euler-Bernoulli
beams optional reading: Silicon
Failure |
|
|
5 |
9/21 9/23 |
Couette damping, (squeeze-film damping) Resonance,
transfer function |
Tang, Nguyen, Howe comb
drive resonator |
|
|
6 |
9/28 9/30 |
Transfer function |
|
|
|
7 |
10/5 10/7 |
Self-sustaining oscillators; Piezoresistivity,
strain gauges Wheatstone, TCR stability
and pull-in, spring tuning |
||
|
8 |
10/12 10/14 |
Midterm Rayleigh-Ritz, Paschen, Field
emission thermal conduction, black body radiation |
2016 Midterm solutions 247A project |
|
|
9 |
10/19 10/21 |
MEMS fabrication, HNA, XeF2 bulk micromachining: crystal planes, etch rates KOH etching |
Jaeger Ch 11 |
|
|
10 |
10/26 10/28 |
Plasma etching Standard processes; Semiconductors: Bohr à
diodes Ion implantation; diffusion; thermal oxidation; diffused piezoresistor |
Jaeger Ch 6 |
|
|
11 |
11/2 11/4 |
CMOS process cross section Standard processes: CMOS MEMS fabrication: evaporation, liftoff |
Nasiri paper Fedder2002
Intel
22nm Jaeger 9.3 |
|
|
12
|
11/9 11/11 |
fabrication: sputtering Veterans
Day – Academic and Administrative Holiday |
|
|
|
13 |
11/16 11/18 |
plasma
etching; RIE ; DRIE LPCVD;
Residual
stress |
Jaeger |
|
|
14 |
11/23 11/25 |
Thanksgiving non-instructional day academic holiday |
|
|
|
15 |
11/30 12/2 |
LPCVD: mousebites, sidewalls thermal noise noise equivalent input; stiction |
|
|
|
16 |
12/7 12/9 |
RRR week; 247: Final projects due 5pm Monday 12/7 by both email and
hardcopy at 512 Cory Hall. |