MWF
1-2, 3106 Etcheverry (ROOM CHANGE FRIDAY
WEEK 2!)
Class
info, homework questions, discussion, etc: piazza
Grades:
bcourses
All homework
Lectures
are linked to the date of the lecture in the syllabus below, or just browse the
lecture directory
My policy on CHEATING. READ IT!
Instructor Office Hours |
Kristofer
S.J. Pister, pister@eecs.berkeley.edu 512
Cory Hall
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TA Office
Hours |
Dan
Contreras, dscontreras@berkeley.edu W
3-4, Th 1-2 location tba |
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Required
Texts |
none |
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Useful
Texts |
Jaeger,
Introduction
to Microelectronic Fabrication, 2nd edition, under $20 used at
amazon (highly recommended) ----------------------------------------------------- Kaajakari, Practical MEMS Kubby, A Guide to Hands-on MEMS Design and Prototyping Kovacs,
Micromachined Transducers Sourcebook Liu,
Foundations of MEMS, 2nd edition Senturia, Microsystem Design Madou, Fundamentals of Microfabrication Young,
Roark’s Formulas for Stress and Strain |
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Grading |
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Homework |
Collaboration
is encouraged; copying is not. Explaining how you solved a problem to
someone is fine; handing them your solutions is not. Helping someone debug their design is fine;
giving them your design is not. Write
your own answers without staring at someone else's. (see cheating policy
above) |
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Lectures |
My
nearly indecipherable notes are generally online a day or two after class (linked
below). |
Schedule
Week |
Date/ Notes |
Topic |
Reading
/ Resources |
Homework |
1 |
Logistics;
What is MEMS; Applications; Course overview, history,
& examples Single-mask
SOI process |
Jaeger: skim chapter 1, and 2.1—2.4. Make sure that you understand Figures 2.{2,
6, 7, 9+11} |
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2 |
[video
lecture] Single-mask capacitive accelerometer simple differential capacitive accelerometer Surface micromachining; three-mask process; |
Jaeger: 11.1, 11.4 |
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3 |
9/5 |
Labor Day Electrostatic Actuators, Gauss, d’Alambert Standard Processes: SOIMUMPs,
POLYMUMPs,
polyMUMPS pictures,
SOIMUMPS pictures |
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4 |
Stress and strain, beam bending, flexure design, torsion, residual stress, stress gradients, buckling |
Euler-Bernoulli
beams optional reading: Silicon
Failure |
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5 |
Couette damping, (squeeze-film damping) Resonance,
transfer function |
Tang, Nguyen, Howe comb
drive resonator |
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6 |
9/26 |
[video/guest] Transfer function Electrostatics:
capacitance, actuation, sensing |
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7 |
Self-sustaining oscillators; Piezoresistivity,
strain gauges Wheatstone, TCR thermal conduction, black body radiation |
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8 |
10/10 |
Midterm Rayleigh-Ritz, Paschen, Field
emission stability
and pull-in, spring tuning |
Midterm solutions 247A project |
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9 |
MEMS fabrication, HNA, XeF2 bulk micromachining: crystal planes, etch rates KOH etching |
Jaeger Ch 11 |
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10 |
10/24 |
Dan Contreras: Micro Robots Standard processes; Semiconductors: Bohr à
diodes Ion implantation; diffusion; thermal oxidation; diffused piezoresistor |
Jaeger Ch 6 |
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11 |
11/2 |
CMOS process cross section Standard processes: CMOS MEMS fabrication: evaporation, liftoff |
Nasiri paper Fedder2002
Intel
22nm Jaeger 9.3 |
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12
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11/11 |
Guest Lecture: Prof. Ming Wu, Optical MEMS fabrication: sputtering Veterans
Day – Academic and Administrative Holiday |
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13 |
plasma
etching; RIE ; DRIE LPCVD;
Residual
stress |
Jaeger |
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14 |
11/23 11/25 |
Guest Lecture: Prof. Dorian Liepmann,
“Micro-fluid dynamics” Thanksgiving non-instructional day (?!?) academic holiday |
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15 |
LPCVD: mousebites, sidewalls thermal noise noise equivalent input; stiction |
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16 |
12/5 12/7 12/9 |
No class Monday WF
247 final project presentations. 147 students strongly encouraged to attend. 247: Final projects due 5pm Monday 12/12 by both email and
hardcopy at 512 Cory Hall. |