MWF
4-5, 155 Donner Lab
Class
info, homework questions, discussion, etc: piazza
Grades:
bcourses
All homework
Lectures
are linked to the date of the lecture in the syllabus below
My policy on CHEATING. READ IT!
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Instructor Office Hours |
Kristofer
S.J. Pister, pister@eecs.berkeley.edu 512
Cory Hall
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TA Office
Hours |
Dan
Contreras, dscontreras@berkeley.edu M
10-11, W 6-7, both in 400 Cory |
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Required
Texts |
Kovacs,
Micromachined Transducers Sourcebook |
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Other
Useful Texts |
Jaeger,
Introduction
to Microelectronic Fabrication, 2nd edition, under $20 used at
amazon (highly recommended) ----------------------------------------------------- Kaajakari, Practical MEMS Kubby, A Guide to Hands-on MEMS Design and Prototyping Chang
Liu, Foundations of MEMS, 2nd edition Senturia, Microsystem Design Madou, Fundamentals of Microfabrication Young,
Roark’s Formulas for Stress and Strain |
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Grading |
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Homework |
Collaboration
is encouraged; copying is not. Explaining how you solved a problem to
someone is fine; handing them your solutions is not. Helping someone debug their design is fine;
giving them your design is not. Write
your own answers without staring at someone else's. |
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Lectures |
My
nearly indecipherable notes are generally online a day or two after class
(linked below). |
Schedule
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Week |
Date/ Notes |
Topic |
Reading
(Kovacs) / Resources |
Homework |
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1 |
Logistics;
What is MEMS; Applications; Course overview & examples Single-mask
SOI process |
Skim
Chapters 1,2 |
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2 |
Single-mask
capacitive accelerometer Surface micromachining; three-mask process; simple
differential capacitive accelerometer guest lecture: Prof. Boser |
11.4 (Jaeger) |
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3 |
9/7 |
Labor Day Electrostatic Actuators, Standard Processes: SOIMUMPs,
POLYMUMPs,
polyMUMPS pictures,
SOIMUMPS pictures |
RSMtalk, ~2000 BSAC history |
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4 |
9/14 |
Stress and strain, beam bending, flexure design, torsion,
residual stress, stress gradients, buckling |
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5 |
9/23 |
Couette damping, (squeeze-film damping) Resonance,
transfer function |
Tang, Nguyen, Howe comb
drive resonator |
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6 |
Transfer function Electrostatics:
capacitance, actuation, sensing |
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7 |
Electrostatics:
Gauss, d’Alambert, stability and pull-in, spring
tuning Piezoresistivity,
strain gauges, Wheatstone |
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8 |
10/14 10/16 |
thermal conduction, TCR Review Midterm |
midterm soln |
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9 |
MEMS fabrication, HNA, XeF2 bulk micromachining: crystal planes, etch rates standard processes |
Jaeger Ch 11 |
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10 |
10/30 |
Semiconductors: Bohr à
CMOS CMOS process cross section Guest lecture: Dr. Mary Ann Maher – CAD for MEMS |
Jaeger Ch 6 |
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11 |
11/4 11/6 |
Standard processes: CMOS MEMS guest
lecture: Luke Lee, BioE; BioMEMS |
Nasiri paper |
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12
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11/9 |
CAD tools: schematic editing, synthesis, place &
route, extraction, simulation, LVS, DRC fabrication: evaporation, liftoff, sputtering |
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13 |
plasma
etching; RIE DRIE LPCVD;
thermal oxidation |
Jaeger, Ch 9.3 |
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14 |
11/25 11/27 |
Stiction Thanksgiving non-instructional day (?!?) academic holiday |
optional for fun: penny-loaded
paper |
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15 |
12/2 12/4 |
thermal noise guest lecture: Prof. Ming Wu, EECS; Optical MEMS ? |
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16 |
12/7 12/9 12/11 |
RRR Week, 247 final project presentations. 147 students strongly encouraged to attend. 247: Final projects due 5pm 12/19 by email and hardcopy at
512 Cory Hall. |