The Opportunity

• A New Generation of Infrastructure

  • Powerful, low-cost computation
  • Networks, 3D graphics support, haptic interfaces
  • New approaches to distributed software development and integration

• The Need for a New Approach to Design

  • Deep-sub-micron silicon
  • Must bridge the productivity gap: Reuse is key!
  • Strong economic driver: time-to-money

Will Require a Comprehensive Approach to the Exploration of New EDA+ Platform Architectures

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