Packaging & MCM
Packaging & MCM
m Requires very close designer/design technologist relationship.
m Significant "methodology"/ infrastructure needs really a "CAD system" issue much more than a "CAD Tool" issue.
m Chip-set "architectures" for broad range of value-added applications + design support are needed.
m Specific tool needs:
Ô Interconnect Analysis and ModellingÔ Routing for high-performanceÔ Design partitioningÔ Power/Noise Analysis