![\"\"](\"http:\/\/localhost\/ctnsite\/wp-content\/uploads\/2021\/04\/IntegratedNiCMOSOsc.ctnguyen.jpg\")
Fully Monolithic CMOS Nickel Micromechanical Resonator Oscillator [2008]
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1st Partial-Filled Gap to Strengthen a Capacitive-Gap Transducer [2008]
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1st Micromechanical Resonant Switch (“Resoswitch”) [2008]
Read More<\/a><\/figcaption><\/figure><\/li><\/ul><\/figure>\n\n\n\nThe year 2008 delivered a fully integrated single-chip oscillator that combined in a fully monolithic process a custom CMOS sustaining amplifier with a MEMS-last spring-coupled nickel flexural-mode disk array. While the nickel resonator Q<\/em> was much lower than polysilicon counterparts and questions on aging remained, this first demonstration is a precursor to work more than a decade later to integrate high frequency metal MEMS in ruthenium for oscillator purposes. This year also brought on the first demonstration of partial gap-filling to improve capacitive-gap transducer strength, as well as the first demonstration of a micromechanical resoswitch–a device destined for use in the first all-mechanical communication receiver almost a decade later.<\/p>\n\n\n\n
W.-L. Huang, Z. Ren, Y.-W. Lin, H.-Y. Chen, J. Lahann, and C. T.-C. Nguyen, \u201cFully monolithic CMOS nickel micromechanical resonator oscillator<\/a>,\u201d\u00a0Tech. Digest<\/em>, 21st<\/sup>\u00a0IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS\u201908), Tucson, Arizona, Jan. 13-17, 2008, pp. 10-13.<\/p>\n\n\n\n
Y. Xie, S.-S. Li, Y.-W. Lin, Z. Ren, and C. T.-C. Nguyen, \u201c1.52-GHz micromechanical extensional wine-glass mode ring resonators<\/a>,\u201d IEEE Trans. Ultrason., Ferroelect., Freq. Contr.<\/em>, vol. 55, no. 4, pp. 890-907, April 2008. (18 pages)<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cIntegrated micromechanical radio front-ends (invited plenary)<\/a>,\u201d Proceedings of Tech. Program<\/em>, 2008 IEEE Int. Symp. On VLSI Technology, Systems, and Applications (VLSI-TSA\u201908), Hsinchu, Taiwan, April 21-23, 2008, pp. 3-4.<\/p>\n\n\n\n
Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, \u201cA resonance dynamical approach to faster, more reliable micromechanical switches<\/a>,\u201d Proceedings<\/em>, 2008 IEEE Int. Frequency Control Symp., Honolulu, Hawaii, May 19-21, 2008, pp. 640-645.<\/p>\n\n\n\n
L.-W. Hung, Z. A. Jacobson, Z. Ren, A. Javey, and C. T.-C. Nguyen, \u201cCapacitive transducer strengthening via ALD-enabled partial-gap filling<\/a>,\u201d Tech. Digest<\/em>, 2008 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 1-5, 2008, pp. 208-211.<\/p>\n\n\n\n
Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, \u201cThe micromechanical resonant switch (\u201cresoswitch\u201d)<\/a>,\u201d Tech. Digest<\/em>, 2008 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 1-5, 2008, pp. 40-43.<\/p>\n","protected":false},"excerpt":{"rendered":"