The year 1998 set the stage for growth of the RF MEMS field over the next decades to come, yielding the first plenary presentation introducing this new field and producing the first publication outlining one of the major drivers for vibrating RF MEMS research: RF channel-selection and its potential to lower power consumption while raising robustness of communications. This year also marked one of the first attempts to suppress micromechanical resonator temperature dependence (via geometric stress compensation) and introduced the micromechanical mixer-filter (a.k.a. mixler) for the first time, as well as communication architectures that use it. The first “mixer first” communication front-end architecture proposal actually derived from a patent using a mixler.<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cMicromechanical devices for wireless communications (invited plenary)<\/a>,\u201d Proceedings, <\/em>1998 IEEE International Workshop on Micro Electro Mechanical Systems, Heidelberg, Germany, Jan. 25-29, 1998, pp. 1-7.<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cFrequency-selective MEMS for miniaturized communication devices (invited)<\/a>,\u201d Proceedings, <\/em>1998 IEEE Aerospace Conference, vol. 1, Snowmass, Colorado, March 21-28, 1998, pp. 445-460.<\/p>\n\n\n\n
S. Pacheco, C. T.-C. Nguyen, and L. P. B. Katehi, \u201cMicromechanical electrostatic K-band switches<\/a>,\u201d Proceedings, <\/em>IEEE MTT-S International Microwave Symposium, Baltimore, Maryland, June 7-12, 1998, pp. 1569-1572. (Judges\u2019 award winner\u2014one of several)<\/em><\/strong><\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cCommunications applications of microelectromechanical systems (invited)<\/a>,\u201d Proceedings<\/em>, 1998 Sensors Expo, San Jose, California, May 20, 1998, pp. 447-455.<\/p>\n\n\n\n
C. T.-C. Nguyen, L. P.B. Katehi, and G. M. Rebeiz, \u201cMicromachined devices for wireless communications (invited)<\/a>,\u201d Proc. IEEE,<\/em> vol. 86, no. 8, pp. 1756-1768, Aug. 1998. (13 pages)<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cMicromachining technologies for miniaturized communication devices (invited plenary)<\/a>,\u201d Proceedings<\/em> of SPIE<\/em>: Micromachining and Microfabrication, Santa Clara, California, Sept. 20-22, 1998, pp. 24-38.<\/p>\n\n\n\n
Wan-Thai Hsu and C. T.-C. Nguyen, \u201cGeometric stress compensation for enhanced thermal stability in micromechanical resonators<\/a>,\u201d Proceedings<\/em>, 1998 IEEE International Ultrasonics Symposium, Sendai, Japan, Oct. 5-8, 1998, pp. 945-948.<\/p>\n\n\n\n
A.-C. Wong, H. Ding, and C. T.-C. Nguyen, \u201cMicromechanical mixer+filters<\/a>,\u201d Technical Digest<\/em>, IEEE International Electron Devices Meeting, San Francisco, California, , Dec. 6-9, 1998, pp. 471-474. (best paper award winner)<\/em><\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"