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First Analytical Treatment for Intermodulation Distortion in Capacitive-Gap Transduced Micromechanical Resonators [2001]
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Lateral Free-Free Beam With Metal Electrodes and Sub-Micron Lateral Electrode-to-Resonator Gaps [2001]
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Bonded-Microplatform MEMS-Transistor Merging [2001]
Read More<\/a><\/figcaption><\/figure><\/li><\/ul><\/figure>\n\n\n\nThe year 2001 brought on rapid advancements in lateral resonator technology, including methods for using metal electrodes (for smaller interconnect resistance) with submicron electrode-to-resonator gaps, lateral free-free-beams for higher Q<\/em>, and methods for realizing sensors based on such resonators. Packaging and integration technologies also entered the picture for the first time, including a vacuum packaging method employing the localized annealing concept from earlier years and a bonded microplatform approach that compression-bonded MEMS upside down to transistor electronics while also providing vacuum packaging. Finally, the year saw demonstrated of the first 10-MHz Pierce oscillator using a polysilicon MEMS resonator, as well as the first analytical understanding of third-order intermodulation distortion nonlinearity in capacitive-gap transduced micromechanical resonators.<\/p>\n\n\n\n
Y.-T. Cheng, W.-T. Hsu, L. Lin, C. T.-C. Nguyen, and K. Najafi, \u201cVacuum packaging using localized aluminum\/silicon-to-glass bonding<\/a>,\u201d\u00a0Technical Digest<\/em>, 14th<\/sup>\u00a0Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 18-21.<\/p>\n\n\n\n
W.-T. Hsu, J. R. Clark, and C. T.-C. Nguyen, \u201cA sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators<\/a>,\u201d Technical Digest<\/em>, 14th<\/sup> Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 349-352.<\/p>\n\n\n\n
R. Navid, J. R. Clark, M. Demirci, and C. T.-C. Nguyen, \u201cThird-order intermodulation distortion in capacitively-driven CC-beam micromechanical resonators<\/a>,\u201d Technical Digest<\/em>, 14th<\/sup> Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 228-231.<\/p>\n\n\n\n
J. R. Clark, W.-T. Hsu, and C. T.-C. Nguyen, \u201cMeasurement techniques for capacitively-transduced VHF-to-UHF micromechanical resonators<\/a>,\u201d Digest of Technical Papers<\/em>, the 11th<\/sup> Int. Conf. on Solid-State Sensors & Actuators (Transducers\u201901), Munich, Germany
, June 10-14, 2001, pp. 1118-1121.<\/p>\n\n\n\nA.-C. Wong, Y. Xie, and C. T.-C. Nguyen, \u201cA bonded-micro-platform technology for modular merging of RF MEMS and transistor circuits<\/a>,\u201d Digest of Technical Papers<\/em>, the 11th<\/sup> Int. Conf. on Solid-State Sensors & Actuators (Transducers\u201901), Munich, Germany, June 10-14, 2001, pp. 992-995.<\/p>\n\n\n\n
W. -T. Hsu, J. R. Clark, and C. T. -C. Nguyen, \u201cA resonant temperature sensor based on electrical spring softening<\/a>,\u201d Digest of Technical Papers<\/em>, the 11th<\/sup> Int. Conf. on Solid-State Sensors & Actuators (Transduc\u00aders\u201901), Munich, Germany, June 10-14, 2001, pp. 1484-1487.<\/p>\n\n\n\n
W. -T. Hsu, J. R. Clark, and C. T. -C. Nguyen, \u201cQ-optimized lateral free-free beam micromechanical resonators<\/a>,\u201d Digest of Technical Papers<\/em>, the 11th<\/sup> Int. Conf. on Solid-State Sensors & Actuators (Transducers\u201901), Munich, Germany, June 10-14, 2001, pp. 1110-1113.<\/p>\n\n\n\n
S. Lee, M. U. Demirci, and Clark T.-C. Nguyen, \u201cA 10-MHz micromechanical resonator Pierce reference oscillator for communications<\/a>,\u201d Digest of Technical Papers<\/em>, the 11th<\/sup> Int. Conf. on Solid-State Sensors & Actuators (Transducers\u201901), Munich, Germany, June 10-14, 2001, pp. 1094-1097.<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cVibrating RF MEMS for low power wireless communications (invited keynote)<\/a>,\u201d Proceedings<\/em>, 2000 Int. MEMS Work shop (iMEMS\u201901), Singapore, July 4-6, 2001, pp. 21-34.<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cTransceiver front-end architectures using vibrating micromechanical signal processors (invited)<\/a>,\u201d Dig. of Papers<\/em>, Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Sept. 12-14, 2001, pp. 23-32.<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cRF MEMS for Low-Power Communications<\/a>,\u201d\u00a0Extended Abstracts<\/em>, 2001 Int. Conf. on Solid-State Devices and Materials (SSDM\u201901),\u00a0Tokyo,\u00a0Japan,\u00a0Sept. 26-28, 2001, pp.\u00a0462-463.<\/p>\n\n\n\n
C. T.-C. Nguyen, \u201cTransceiver front-end architectures using vibrating micromechanical signal processors<\/a>,\u201d chapter in RF Technologies for Low Power Wireless Communications, <\/em>edited by G. I. Haddad, T. Itoh, and J. Harvey, pp. 411-461. New York: Wiley IEEE-Press, 2001. (50 pages)<\/p>\n","protected":false},"excerpt":{"rendered":"