{"id":177,"date":"2020-07-15T02:02:13","date_gmt":"2020-07-15T02:02:13","guid":{"rendered":"http:\/\/localhost\/ctnsite\/?page_id=177"},"modified":"2021-06-06T06:07:07","modified_gmt":"2021-06-06T06:07:07","slug":"2002-publications","status":"publish","type":"page","link":"http:\/\/localhost\/ctnsite\/2002-publications\/","title":{"rendered":"2002 Publications"},"content":{"rendered":"\n
The year 2002 brought about the first CVD polydiamond MEMS devices, identifying this material as more stable and higher frequency than other popular materials at the time; and the first MEMS resonator to post temperature stability (without the aid of transistor control) commensurate with the needs to practical timing applications and substantially better than achievable by quartz counterparts. The first company formed to commercialize MEMS-based timing, Discera, founded by me, had been going for about a year at this point. It was not long before several other start-ups joined the game, encouraged by Discera’s success and results like this.<\/p>\n\n\n\n
J. Wang, J. E. Butler, D. S. Y. Hsu, and C. T.-C. Nguyen, \u201cCVD polycrystalline diamond high-Q<\/em> micromechanical resonators<\/a>\u201d Tech. Digest<\/em>, 2002 IEEE Int. Micro Electro Mechanical Systems Conf., Las Vegas, Jan. 20-24, 2002, pp. 657-660.<\/p>\n\n\n\n W. -T. Hsu and C. T. -C. Nguyen, \u201cStiffness-compensated temperature-insensitive micromechanical resonators<\/a>,\u201d Tech. Digest<\/em>, 2002 IEEE Int. Micro Electro Mechanical Systems Conf., Las Vegas, Nevada, Jan. 20-24, 2002, pp. 731-734.<\/p>\n\n\n\n Y. Xie and C. T.-C. Nguyen, \u201cA low-voltage tiltable microplatform using bent-beam actuation<\/a>\u201d Tech. Digest<\/em>, 2002 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 2-6, 2002, pp. 350-353.<\/p>\n\n\n\n J. Wang, J. E. Butler, D. S. Y. Hsu, and C. T.-C. Nguyen, \u201cHigh-Q<\/em> micromechanical resonators in CH4<\/sub>-reactant-optimized high acoustic velocity CVD polydiamond<\/a>,\u201d Tech. Digest<\/em>, 2002 Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head, South Carolina, June 2-6, 2002, pp. 61-62.<\/p>\n\n\n\n C. T.-C. Nguyen, \u201cRF MEMS for wireless applications (invited keynote<\/a>),\u201d\u00a0Conf. Digest<\/em>, 2002 Device Research Conference, Santa Barbara, California, June 24-26, 2002, pp.\u00a09-12.<\/p>\n\n\n\n Y.-T. Cheng, W.-T. Hsu, K. Najafi, C. T.-C. Nguyen, and L. Lin, \u201cVacuum packaging technology using localized aluminum\/silicon-to-glass bonding<\/a>,\u201d IEEE\/ASME J. Microelectromech. Syst.<\/em>, vol.\u00a011, no.\u00a05, pp.\u00a0556-565, Oct. 2002. (10 pages)<\/p>\n\n\n\n