{"id":168,"date":"2020-07-15T01:41:51","date_gmt":"2020-07-15T01:41:51","guid":{"rendered":"http:\/\/localhost\/ctnsite\/?page_id=168"},"modified":"2021-06-06T06:34:50","modified_gmt":"2021-06-06T06:34:50","slug":"2006-publications","status":"publish","type":"page","link":"http:\/\/localhost\/ctnsite\/2006-publications\/","title":{"rendered":"2006 Publications"},"content":{"rendered":"\n
2006 was the year I left DARPA and went back to Michigan, then moved out to UC Berkeley. Still, the year produced some important results, including the first disk resonator-based spring-coupled filter–a precursor to the next year’s transformational design–and the first stemless disk resonator (in nickel) supported by solid electrode-to-resonator gaps.<\/p>\n\n\n\n
S.-S. Li, Y.-W. Lin, Z. Ren, and C. T.-C. Nguyen, \u201cDisk-array design for suppression of unwanted modes in micromechanical composite-array filters<\/a>,\u201d Tech. Digest<\/em>, 19th<\/sup> IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS\u201906), Istanbul, Turkey, Jan. 22-26, 2006, pp. 866-869.<\/p>\n\n\n\n C. T.-C. Nguyen, \u201cMEMS technologies and devices for single-chip RF front-ends (invited)<\/a>,\u201d 2005 IMAPS\/ACerS Int. Conf. on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Tech. Dig.<\/em>, Denver, Colorado, April 25-26, 2006.<\/p>\n\n\n\n W.-L. Huang, Z. Ren, and C. T.-C. Nguyen, \u201cNickel vibrating micromechanical disk resonator with solid dielectric capacitive-transducer gap<\/a>,\u201d Proceedings<\/em>, 2006 IEEE Int. Frequency Control Symp., Miami, Florida, June 5-7, 2006, pp. 839-847.<\/p>\n\n\n\n C. T.-C. Nguyen, \u201cTowards LSI vibrating micromechanical signal processors (invited)<\/a>,\u201d Proceedings of the 32nd<\/sup> Int. Conference on Micro- and Nano-Engineering, Barcelona, Spain, Sept. 17-20, 2006, pp. 69-70.<\/p>\n\n\n\n C. T.-C. Nguyen, \u201cIntegrated micromechanical circuits for RF front ends (invited)<\/a>,\u201d Proceedings<\/em> of the 36th<\/sup> European Solid-State Device Research Conference, Montreux, Switzerland, Sept. 19-21, 2006, pp. 7-16.<\/p>\n\n\n\n C. T.-C. Nguyen, \u201cIntegrated micromechanical circuits fueled by vibrating RF MEMS technology<\/a>,\u201d\u00a0Proceedings<\/em>, IEEE Int. Ultrasonics Symposium, Oct. 2-6, 2006, pp. 953-962.<\/p>\n\n\n\n