Motivation
Plasma instabilities observed in low pressure ìmediumî and ìhighî density (inductive) processing discharges with electronegative gas feedstocks (O-, F-, or Cl-containing)
What determines stable/unstable operating parameter windows (power, pressure, etc)?
What is the relation to pulsed power processing (lower Te, negative ion fluxes to substrates, etc)?
How do instabilities impact processing performance and process measurements (notching, charging damage, endpoint detection, etc)?